Ajinomoto

Recent Innovation Focus

• •Reliability limitations in high-density semiconductor devices caused by dielectric loss and thermal warpage are addressed through epoxy-based insulator innovations
• •Sensory profile degradation from microwave-induced moisture migration and chemical off-notes is mitigated via moisture and flavor modulation techniques
• •Lamination warpage and cracking resulting from inorganic filler distribution and resin curing shrinkage are reduced through improved insulating material formulations