Ajinomoto

Last updated January 31, 2026

Innovation Areas

1,635

Inventors

Collaborations

Multilayer circuit build-up architecture: AjinomotoRecent Research Landscape

Interconnect failures and signal loss occur when dielectric layers lack uniform thickness or adhesion. These innovations utilize specialized adhesive films to control the structural integrity and electrical insulation of multi-layer boards.

What technical problems is Ajinomoto addressing in Multilayer circuit build-up architecture?

Interlayer adhesion failure

(14)evidences

Delamination between resin sheets and metal foils during build-up processes leads to structural instability. Improving bonding integrity prevents electrical failure in high-density interconnects.

Interlayer interconnection manufacturing defects

(13)evidences

Misalignment and dimensional instability during sequential build-up processes cause electrical shorts or open circuits. Precise layer stacking ensures high-density interconnect reliability.

Interlayer registration inaccuracy

(10)evidences

Delamination and structural instability between dielectric layers and conductive circuits during thermal or mechanical stress. Eliminating these defects ensures long-term reliability and signal integrity in high-density interconnects.