Unprotected resin surfaces and chip interfaces are vulnerable to particulates and chemical damage during handling. Preventing surface defects ensures high yield in semiconductor packaging.

Thin resin layers lack the structural integrity to be processed without deformation or damage. Providing temporary support prevents mechanical failure during manufacturing steps.

Delamination and structural instability between stacked polymer layers. Preventing separation ensures mechanical integrity and long-term durability of composite structures.

Mechanical failure of multi-material interfaces during thermal or chemical manufacturing steps. Preventing separation ensures structural integrity of the final semiconductor package.