Insufficient chemical stability and poor contrast in photosensitive layers lead to blurred edges and pattern collapse. Improving the resin stoichiometry prevents structural defects during micro-fabrication.

Delamination and mechanical failure occur between the resin layer and the support or substrate during semiconductor fabrication. Improving bond integrity ensures structural reliability in high-density printed wiring boards.

Variations in monomer ratios and component distribution lead to unpredictable mechanical and chemical performance. Standardizing stoichiometry across kits prevents structural failure and ensures reproducible manufacturing outcomes.