Standard polyphenol formulations often suffer from mechanical or thermal failure after crosslinking. Improving the integrity of the cured state prevents material degradation in demanding environments.

Inherent brittleness and poor mechanical stability in cured phenolic networks. Improving these properties prevents premature material failure under stress.

Uncontrolled volumetric shrinkage and thermal expansion during curing lead to mechanical failure. Improving structural integrity prevents delamination and warping in high-performance applications.

Semiconductor packaging and circuit boards suffer from mechanical failure due to mismatched thermal expansion and poor adhesion between layers. Mitigating these stresses prevents structural cracking and electrical failure.