Ajinomoto

Last updated January 31, 2026

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Resin sheet metal foil lamination: AjinomotoRecent Research Landscape

Delamination and registration errors during substrate buildup increase scrap rates in high-density interconnects. These methods control the interface between resin sheets and metal foils to ensure structural integrity.

What technical problems is Ajinomoto addressing in Resin sheet metal foil lamination?

Interlayer adhesion failure

(17)evidences

Inconsistent bonding between resin sheets and metal foils leads to structural failure or air entrapment. Eliminating these defects ensures the mechanical integrity of multi-layered circuit substrates.

Interlayer adhesion failure

(12)evidences

Misalignment between conductive layers and insulating substrates during lamination leads to circuit failure. Precise positioning ensures electrical continuity and high-density interconnect reliability.