Standard encapsulation methods suffer from structural instability and environmental ingress. Improving sealing integrity prevents mechanical damage and chemical degradation of sensitive electronic parts.

Poor adhesion and mechanical instability between resin layers and supporting sheets lead to structural delamination. Improving interfacial integrity ensures long-term durability in protective sealing applications.

Environmental degradation and moisture penetration compromise the integrity of delicate electronic assemblies. Preventing this failure mode ensures long-term functional reliability and prevents short-circuiting.