Ajinomoto

Last updated January 31, 2026

Innovation Areas

1,635

Inventors

Collaborations

Thermosetting epoxy resin sealant: AjinomotoRecent Research Landscape

Inconsistent thermal bonding leads to delamination and structural failure in protective packaging. Precise control of the polymer resin composition and sheet layering ensures interfacial adhesion and environmental barrier integrity.

What technical problems is Ajinomoto addressing in Thermosetting epoxy resin sealant?

Moisture induced device degradation

(16)evidences

Thin-film resin layers suffer from poor structural integrity during processing and weak adhesion to substrates. Resolving these mechanical vulnerabilities prevents device failure during assembly and improves manufacturing yield.

Interfacial delamination and handling fragility

(5)evidences

Thin-film resin structures suffer from mechanical failure and poor adhesion during thermal cycling. Preventing structural separation ensures long-term component reliability.