Atlas Copco

Last updated February 26, 2026

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Modular power electronics thermal integration: Atlas CopcoRecent Research Landscape

Thermal instability and electrical interference in high-density power electronics lead to component failure and energy loss. This architecture mitigates these risks through independent cooling chambers and integrated busbar-capacitor mounting to stabilize power flow.

What technical problems is Atlas Copco addressing in Modular power electronics thermal integration?

Thermal density packaging constraints

(7)evidences

High-density power electronics suffer from heat transfer between adjacent modules, capacitors, and transformers. Mitigating this thermal coupling prevents premature component failure and localized overheating in compact energy storage systems.