Thermoplastic polyurethane polyamide interlayers: BASFRecent Research Landscape
Delamination between dissimilar materials causes structural failure and moisture ingress in high-performance packaging. This architecture engineers the interfacial bond between metal and polymer layers to ensure mechanical integrity.
What technical problems is BASF addressing in Thermoplastic polyurethane polyamide interlayers?
Insufficient composite thermoformability
(18)evidences
Rigid fiber-reinforced structures often fail or crack during secondary shaping processes. Improving the ability of a composite to undergo significant deformation under heat without structural failure allows for complex geometry manufacturing.
Interfacial adhesion failure
(17)evidences
Weak bonding between chemically distinct polymer layers and mineral substrates leads to structural delamination. Improving surface compatibility ensures mechanical integrity in multi-material laminates.