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Last updated January 31, 2026
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Conductive interface thermal coupling: BayerRecent Research Landscape

Thermal losses and mechanical wear at high-current contact points increase charging downtime and safety risks. These innovations engineer the physical mating interface to ensure consistent electrical continuity and heat dissipation.

What technical problems is Bayer addressing in Conductive interface thermal coupling?

Interfacial thermal contact resistance

(30)evidences

High-current electrical transfer across plug-and-socket connections generates localized thermal stress and contact degradation. Mitigating this heat buildup prevents component melting and enables sustained high-power charging rates.

Inadequate spatial integration constraints

(17)evidences

Misalignment between charging interfaces causes significant energy loss and electromagnetic interference. Precise physical positioning ensures maximum power transfer efficiency and prevents thermal buildup.

Charging interface mechanical failure

(12)evidences

Theft and physical tampering of charging infrastructure during operation. Preventing unauthorized disconnection ensures energy security and hardware integrity.

Inadequate electrical interface protection

(9)evidences

Mechanical misalignment and unstable physical connections during high-current energy transfer. Eliminating connection instability prevents thermal runaway and electrical arcing during rapid charging.