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Last updated January 31, 2026
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Dual path thermal conduction architecture: BayerRecent Research Landscape

Thermal and electrical stress in high-current automotive applications leads to premature component failure. These innovations engineer the physical submodule layout and interconnects to ensure reliable power distribution.

What technical problems is Bayer addressing in Dual path thermal conduction architecture?

Excessive power electronic heat

(12)evidences

High-current electronic components and CVD processes generate thermal loads that exceed passive dissipation limits. Mitigating localized thermal stress prevents component failure and maintains process stability.

Parasitic inductance and electromagnetic interference

(10)evidences

Parasitic inductance and switching noise in power electronics create signal degradation and regulatory non-compliance. Mitigating these disturbances ensures electromagnetic compatibility and prevents damage to sensitive vehicle electronics.