Weak bonding between dissimilar materials leads to structural delamination and component breakdown. Enhancing interfacial integrity prevents premature failure in high-stress applications like battery packs and polishing systems.

Standard organic insulators suffer from electrical leakage and thermal degradation in high-voltage motor environments. Preventing these failure modes ensures long-term reliability in demanding vehicle applications.

Structural adhesives and pressure-sensitive tapes often fail due to weak adhesion at the contact interface under mechanical or thermal stress. Enhancing bond integrity ensures reliability in high-stakes applications like batteries and CMP pads.

Weak adhesion between carbon substrates and protective layers leads to structural delamination. Improving this interface prevents mechanical failure in high-stress environments.