Flexible die-cut substrate architecture: BYDRecent Research Landscape
Uncontrolled electrical surges and thermal runaway risk catastrophic failure in high-density energy storage. These innovations mitigate these hazards through hardware-level circuit isolation and redundant protection logic.
What technical problems is BYD addressing in Flexible die-cut substrate architecture?
Mechanical stress during assembly
(49)evidences
Uncontrolled current surges or short circuits lead to catastrophic failure of energy storage cells. Preventing these failures ensures operational safety and prevents thermal runaway in power-consuming devices.
Inaccurate cell voltage monitoring
(33)evidences
Electromagnetic noise and signal distortion during high-voltage data collection. Eliminating these errors ensures accurate battery state-of-charge monitoring and prevents premature cell degradation.