Geometric fin heat dissipation structure: BYDRecent Research Landscape
Inefficient thermal exchange in vehicle enclosures leads to component failure and reduced power density. These innovations engineer specific fin geometries and structural configurations to maximize heat dissipation surface area.
What technical problems is BYD addressing in Geometric fin heat dissipation structure?
Insufficient thermal interface conductivity
(36)evidences
High-power density in IGBT modules and electronic housings leads to critical overheating and component degradation. Addressing this prevents system failure and extends the operational lifespan of power electronics.
Insufficient thermal exchange capacity
(19)evidences
Thermal accumulation in vehicle electrical equipment leads to component failure. Improving heat dissipation prevents thermal throttling and extends hardware lifespan.