BYD

Last updated February 1, 2026

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Insulated gate bipolar transistor packaging: BYDRecent Research Landscape

Thermal and electrical parasitic losses in high-current motor controllers lead to component failure and reduced vehicle range. This architecture engineers the physical interconnects and substrate layering to maximize heat dissipation and power density.

What technical problems is BYD addressing in Insulated gate bipolar transistor packaging?

Excessive thermal resistance

(100)evidences

High power density in semiconductor modules leads to heat buildup that causes device failure. Mitigating this thermal bottleneck prevents catastrophic degradation and extends operational lifespan.

System integration space constraints

(38)evidences

Physical volume limitations and layout complexity in vehicle motor controllers. Reducing the footprint allows for higher power density and simplified assembly in confined automotive environments.