BYD

Last updated February 1, 2026

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Integrated busbar interconnect architecture: BYDRecent Research Landscape

Mechanical instability and thermal expansion in high-current connections cause electrical failure and fire risks. These innovations stabilize the conductive interface through rigid copper assembly structures to ensure power distribution reliability.

What technical problems is BYD addressing in Integrated busbar interconnect architecture?

Interconnect assembly complexity

(50)evidences

High contact resistance and thermal dissipation issues at cell-to-busbar junctions limit power density. Reducing these losses prevents overheating and improves energy efficiency in high-current drive systems.

Mechanical interconnect misalignment

(28)evidences

Standard rigid battery pack architectures suffer from tolerance stack-up and structural stresses during assembly. Resolving interface mismatches between cells and vehicle frames prevents mechanical failure and assembly bottlenecks.

Unintentional short circuit risk

(10)evidences

Uncontrolled short circuits or overcurrent events lead to catastrophic battery failure. Mitigating these risks ensures the safety and longevity of high-density power systems.