Interconnect and module housing architecture: BYDRecent Research Landscape
Mechanical instability in pouch-cell configurations leads to premature electrical failure and thermal runaway risks. These innovations engineer the physical housing and interconnect layout to ensure structural integrity and thermal dissipation.
What technical problems is BYD addressing in Interconnect and module housing architecture?
Insecure cell mechanical fixation
(92)evidences
Insecure internal component movement leads to structural failure or electrical disconnection. Eliminating shifting ensures long-term reliability in mobile applications.
Inefficient spatial integration density
(83)evidences
Volumetric overhead in multi-level assemblies limits energy density. Reducing dead space within housing architectures increases vehicle range and structural efficiency.