BYD

Last updated February 1, 2026

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Interconnect busbar assembly architecture: BYDRecent Research Landscape

High electrical resistance at cell-to-pack junctions causes thermal runaway and power loss. These innovations engineer the physical conductive pathways to ensure stable current distribution and mechanical integrity.

What technical problems is BYD addressing in Interconnect busbar assembly architecture?

Interconnect assembly complexity

(58)evidences

High resistance at connection points causes localized heating and power loss. Minimizing this resistance ensures efficient energy transfer and prevents thermal runaway in high-current vehicle applications.

Structural instability during transport

(55)evidences

Mechanical instability and shifting of cells during transport or operation lead to structural failure. Preventing unintended movement ensures electrical contact integrity and system safety.

Structural instability under mechanical stress

(32)evidences

Mechanical instability and assembly complexity within high-density energy storage systems. Resolving these structural vulnerabilities prevents electrical disconnection and improves pack durability under vehicular stress.