Physical volume limitations and assembly complexity in high-density power electronics. Reducing footprint improves vehicle packaging efficiency and thermal management.

Thermal accumulation in motor control units leads to component failure and reduced power density. Mitigating heat stress prevents thermal throttling and extends the operational lifespan of vehicle propulsion systems.

Physical volume limitations and packaging complexity in electric vehicle powertrains. Reducing footprint increases power density and simplifies vehicle assembly.

Mechanical failure and environmental vulnerability of electronics in high-vibration automotive environments. Robust mounting prevents fatigue-induced solder joint failure and ensures thermal stability.