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Last updated February 1, 2026
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Junction temperature monitoring circuit: BYDRecent Research Landscape

Thermal runaway in power semiconductors causes catastrophic inverter failure and vehicle downtime. These innovations integrate real-time junction monitoring to trigger protective modulation before hardware degradation occurs.

What technical problems is BYD addressing in Junction temperature monitoring circuit?

High voltage insulation failure

(31)evidences

Leakage currents and dielectric breakdown in battery systems pose safety risks and hardware damage. Detecting these faults ensures operational safety and prevents catastrophic electrical shorts.

Thermal measurement signal inaccuracy

(20)evidences

Signal degradation and gain inconsistencies during multi-channel sampling prevent precise junction temperature readings. Resolving this ensures reliable power electronics protection and prevents premature component failure.

Thermal runaway risk

(20)evidences

Inconsistent ambient data and sensor lag prevent precise internal temperature tracking. Accurate detection prevents thermal runaway and optimizes charging speed.

Thermal runaway risk

(11)evidences

Thermal runaway and overcurrent events lead to catastrophic failure in motor controllers and vehicle electronics. Preventing these failures ensures operational safety and hardware longevity.