Mismatched expansion coefficients between metal and ceramic layers cause delamination and cracking during power cycling. Mitigating these stresses prevents catastrophic module failure in high-power vehicle applications.

Excessive heat accumulation in power modules leads to component failure and system instability. Mitigating this thermal degradation ensures operational reliability in high-power vehicle electronics.

Excessive heat accumulation in high-power vehicle electronics leads to component failure and reduced efficiency. Improving heat transfer rates prevents thermal runaway and extends hardware lifespan.

High-power electronic components experience rapid thermal buildup that leads to device failure. Improving the rate of heat removal prevents thermal throttling and extends component lifespan.