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Last updated February 1, 2026
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Modular battery interconnect architecture: BYDRecent Research Landscape

Thermal runaway and mechanical failure in high-density packs increase safety risks and warranty costs. This lever engineers the physical and electrical integration of cells to ensure structural integrity and uniform current distribution.

What technical problems is BYD addressing in Modular battery interconnect architecture?

Thermal gradient non uniformity

(134)evidences

Non-uniform heat distribution across high-density battery assemblies causes premature cell aging and safety risks. Mitigating these temperature variances ensures pack longevity and prevents localized thermal runaway.

Excessive thermal gradient accumulation

(48)evidences

Inadequate coordination between high-voltage distribution, cell-level connectivity, and monitoring subsystems leads to catastrophic power loss or thermal runaway. Resolving this ensures operational reliability across complex multi-component vehicle architectures.