Modular interconnect architecture: BYDRecent Research Landscape
Manual assembly errors and vibration-induced fatigue lead to catastrophic pack failure. Standardized interlocking geometries ensure structural integrity and electrical continuity during high-stress operation.
What technical problems is BYD addressing in Modular interconnect architecture?
Structural assembly instability
(83)evidences
Mechanical shifting and vibration-induced damage during the movement of high-mass battery assemblies. Preventing structural failure ensures electrical continuity and safety during logistics.
Inadequate power distribution density
(62)evidences
Limited volumetric efficiency in multi-cell assemblies restricts total energy capacity. Overcoming this constraint increases vehicle range and reduces system footprint.
Interconnect assembly complexity
(52)evidences
High resistance and thermal losses at connection points limit power delivery in dense battery arrays. Reducing these bottlenecks prevents localized overheating and improves energy transfer efficiency across the vehicle powertrain.
Inefficient high-voltage power integration
(32)evidences
Limited volumetric energy density in multi-cell assemblies. Reducing dead space and assembly complexity increases vehicle range and manufacturing throughput.