BYD

Last updated February 1, 2026

720

Innovation Areas

34,443

Inventors

189

Collaborations

Modular pcie bus interface architecture: BYDRecent Research Landscape

Thermal management and structural integrity constraints in mobile form factors limit processing power. Engineering the internal chassis and component layout mitigates heat-induced throttling and mechanical failure.

What technical problems is BYD addressing in Modular pcie bus interface architecture?

Inadequate operator interface visibility

(117)evidences

Restricted sightlines and poor display positioning in rail vehicle cabins. Improving information accessibility reduces operator fatigue and safety risks.

Optical path obstruction

(32)evidences

Fragmented mounting and connectivity of external sensors and lighting modules. Unified modular interfacing reduces assembly complexity and signal interference.

Driver visual glare interference

(22)evidences

Dynamic lighting conditions cause temporary blindness or reduced visibility for vehicle operators. Mitigating this impairment improves safety and operational comfort by maintaining clear lines of sight.