Mismatched thermal expansion between power modules and cooling plates causes mechanical fatigue and bond failure. Mitigating this degradation ensures long-term structural integrity and heat dissipation efficiency in high-power vehicle electronics.

Excessive heat accumulation in power modules leads to component failure and system instability. Mitigating this thermal stress prevents permanent device degradation and ensures operational safety in high-power vehicle electronics.

Differential expansion rates between rigid semiconductor cooling plates and electronic substrates cause mechanical stress and delamination. Mitigating this failure mode ensures structural integrity and consistent heat transfer in high-power modules.