Crystalline structural differences between the substrate and the epitaxial layer lead to stacking faults and dislocations. Minimizing these defects prevents electrical leakage and improves device yield.

Weak bonding at material interfaces leads to mechanical separation and electrical discontinuity. Improving interfacial integrity prevents delamination during thermal cycling and high-stress processing.

Loss of high-value diamond particles within oily byproduct streams prevents material reuse. Recovering these materials reduces manufacturing overhead and environmental impact.