Weak bonding between ceramic substrates and metallic or organic layers leads to structural delamination. Improving interfacial integrity ensures mechanical reliability in high-power electronic components.

Standard ceramic substrates lack consistent coloration and surface finish required for consumer electronics. Achieving uniform visual properties prevents material rejection in high-end mobile applications.

Standard vehicle structural components lack the thermal conductivity required to manage high heat loads in power electronics. Integrating structural integrity with efficient thermal pathways prevents component failure and improves vehicle energy density.

Entrainment of diamond particles in oily lubricants and glass residues prevents material reuse. Removing these contaminants recovers high-value abrasives and reduces industrial waste streams.

Inadequate flexibility and structural integrity during the shaping of silicon nitride sheets lead to fractures before sintering. Reducing fragility allows for complex geometries and thinner profiles in electronic housings.