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Last updated February 1, 2026
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Thermal compression adhesive interface: BYDRecent Research Landscape

Adhesive buildup on heating elements causes equipment downtime and bonding defects. These innovations engineer the contact interface and thermal cycle to prevent glue adhesion during high-pressure curing.

What technical problems is BYD addressing in Thermal compression adhesive interface?

Material waste accumulation

(37)evidences

Inefficient removal of debris and scrap during high-speed precision cutting leads to mechanical interference and process downtime. Effective waste discharge prevents contamination and ensures continuous production flow.

Substrate deformation and wrinkling

(32)evidences

Fluctuations in foil tension during curing and coating lead to substrate deformation or coating defects. Maintaining precise mechanical stability prevents material wastage and ensures uniform layer adhesion.

Inconsistent adhesive bond integrity

(32)evidences

Non-uniform pressure or temperature distribution during hot pressing leads to mechanical failure or poor electrical insulation. Ensuring uniform adhesion prevents structural delamination and component damage in high-precision battery and electrical assembly.

Surface contaminant accumulation

(19)evidences

Accumulated debris on rollers and shell components causes mechanical interference and interface defects. Removing these contaminants prevents material degradation and ensures uniform thermal contact.