Standard radiation curing fails in opaque substrates or complex geometries where light cannot reach. Dual curing mechanisms ensure structural integrity in non-illuminated areas.

Standard acrylic hot melts suffer from poor internal crosslinking in thick layers due to limited light penetration. Integrating monomeric photoinitiators ensures uniform structural integrity throughout the adhesive bond.

Standard acrylic pressure sensitive adhesives suffer from shear failure and loss of structural integrity under thermal stress. Enhancing crosslinking density through UV-curable hybrid systems prevents adhesive flow and mechanical breakdown in demanding environments.