Henkel

Last updated January 31, 2026

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Dielectric heating foamable compositions: HenkelRecent Research Landscape

Conventional thermal curing of protective packaging creates uneven density and slow cycle times. This lever utilizes dielectric energy to trigger uniform expansion in eco-friendly substrates for consistent structural integrity.

What technical problems is Henkel addressing in Dielectric heating foamable compositions?

Excessive composite substrate weight

(15)evidences

Slow or non-uniform thermal activation in thick-walled expandable materials prevents rapid expansion. Overcoming this limitation reduces cycle times and ensures consistent structural density.

Excessive vehicle cabin noise

(6)evidences

Non-uniform thermal distribution during the expansion of thick-walled or complex polymer sections. Achieving rapid and homogeneous core-to-surface curing prevents structural defects and reduces cycle times.