Dual-cure photopolymerizable resin networks: HenkelRecent Research Landscape
Surface inhibition and high viscosity prevent rapid processing and uniform application in potting. These formulations engineer specific monomer ratios to achieve immediate tack-free surfaces and low-viscosity flow for defect-free encapsulation.
What technical problems is Henkel addressing in Dual-cure photopolymerizable resin networks?
Incomplete shadow zone curing
(22)evidences
Oxygen inhibition and residual surface tackiness prevent structural integrity in multi-stage assembly. Eliminating surface stickiness ensures handling stability and prevents contamination during secondary processing.
Insufficient substrate interfacial adhesion
(15)evidences
Low green strength and poor immediate adhesion in liquid resins before full curing. Improving early-stage structural integrity prevents component shifting during complex assembly processes.