Inconsistent signal transmission and high contact resistance in printed electronics. Improving conductivity stability ensures signal integrity in flexible antenna applications.

The reliance on pure silver for conductive bonding creates prohibitive material costs. Integrating copper alloys maintains electrical performance while reducing the economic burden of precious metal usage.

Insufficient bonding strength between conductive materials and solar cell surfaces leads to mechanical detachment and electrical discontinuity. Improving adhesion at these interfaces ensures long-term structural integrity and consistent power output.

Unwanted electromagnetic radiation causes functional failure or data corruption in electronic components. Mitigating this interference ensures signal integrity and prevents device malfunction.