Multilayer substrate lamination architecture: HenkelRecent Research Landscape
Inconsistent barrier properties in packaging lead to product spoilage and material waste. These methods engineer the structural layering sequence to ensure substrate integrity and shelf-life stability.
What technical problems is Henkel addressing in Multilayer substrate lamination architecture?
Excessive substrate layer weight
(4)evidences
Standard packaging materials lack adequate impact absorption and structural integrity. Enhancing foam formation within substrates prevents mechanical damage to contents during transit.
Interlayer adhesion failure
(3)evidences
Multilayer substrates are prone to structural instability and delamination during the lamination process. Preventing mechanical separation between layers ensures structural integrity and barrier performance.