Henkel

Last updated January 31, 2026

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Reactive diluent thermal interface patterning: HenkelRecent Research Landscape

Silicone migration and high interfacial resistance cause component failure and signal interference in sensitive electronics. These compositions utilize non-silicone phase change materials to ensure high thermal conductivity without the risk of oil bleeding or contamination.

What technical problems is Henkel addressing in Reactive diluent thermal interface patterning?

Inadequate thermal interface conformability

(11)evidences

Inadequate contact between heat-generating components and cooling hardware limits heat transfer efficiency. Reducing this resistance prevents component overheating and improves device reliability.

Inadequate heat dissipation efficiency

(10)evidences

High contact resistance and air gaps at material boundaries impede heat dissipation. Minimizing these thermal barriers prevents component overheating and sensor inaccuracy.

Excessive heat accumulation

(7)evidences

Uncontrolled heat transfer between adjacent battery cells leads to catastrophic system failure. Preventing this chain reaction ensures passenger safety and structural integrity during electrical faults.