Standard conductive materials exhibit insufficient sensitivity or stability when monitoring temperature changes. Improving response accuracy ensures critical component protection in high-heat environments.

Mechanical failure and delamination at the contact points between conductive adhesives and substrates. Improving adhesion prevents electrical discontinuity and structural degradation in photovoltaic assemblies.

Unwanted electromagnetic noise disrupts electronic device functionality and signal integrity. Mitigating this interference prevents hardware malfunction and ensures reliable high-frequency performance.