Poor electrical continuity between conductive particles and substrates limits signal integrity. Reducing interface resistance ensures efficient charge transport in printed electronics.

Mechanical separation or high resistance at the junction between conductive substrates and adhesives leads to device malfunction. Ensuring robust electrical continuity under mechanical stress prevents power loss in solar and electronic assemblies.

Pure silver bonding layers suffer from prohibitive expense and susceptibility to electrochemical migration. Integrating copper alloys addresses these reliability and economic bottlenecks while maintaining conductivity.

Electronic components suffer from signal interference and performance degradation due to inadequate conductive barriers. Establishing high conductivity on non-conductive substrates prevents data loss and hardware malfunction.