Thermoplastic surfaces naturally resist chemical bonding with thermosetting resins, leading to delamination or structural failure. Improving surface energy through UV activation ensures structural integrity in high-stress aerospace and automotive applications.

Low surface energy and chemical inertness of rubber prevent strong bonding with other materials. Overcoming this limitation ensures structural integrity in multi-material assemblies.

Inert thermoplastic surfaces lack the chemical reactivity required for robust molecular bonding. Overcoming this surface passivity prevents mechanical failure and delamination at the material interface.

Substrate separation and weak bonding interfaces in thin film composites. Eliminating delamination ensures structural integrity during semiconductor packaging.