IFF

Last updated January 31, 2026

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3d integrated photonic passive interconnects: IFFRecent Research Landscape

Surface defects and non-uniform film growth during thin-film fabrication lead to device failure. These innovations utilize capacitively coupled plasma to control atomic-scale deposition for high-performance optoelectronic layers.

What technical problems is IFF addressing in 3d integrated photonic passive interconnects?

Interconnect density bottlenecks

(5)evidences

High-frequency signal attenuation and parasitic interference between stacked device layers. Reducing these losses ensures signal integrity in vertically integrated photonic and electronic circuits.