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Last updated January 31, 2026
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Multimodal additive substrate integration: IFFRecent Research Landscape

Inconsistent active ingredient release and transfer efficiency lead to poor print quality and material waste. These innovations utilize a matrix-housed capsule structure to stabilize the payload and ensure precision delivery during the transfer process.

What technical problems is IFF addressing in Multimodal additive substrate integration?

Inconsistent multi-material surface adhesion

(2)evidences

Variability in the deposition and adhesion of complex coatings during printing leads to defective functional layers. Standardizing transfer reliability ensures structural integrity across diverse substrates.