Incomplete removal of resist layers and structural instability during liquid processing leads to pattern defects. Minimizing these failures ensures high-fidelity semiconductor feature definition.

Capillary forces during the drying phase of liquid processing cause structural failure of high-aspect-ratio features. Preventing this mechanical instability allows for smaller, more densely packed semiconductor architectures.

Capillary forces during the drying of liquid phase resists cause fine features to lean or break. Preventing this mechanical failure allows for higher aspect ratio structures in semiconductor manufacturing.