In the area of strain engineering for semiconductors, one of the major challenges is achieving precise control over the strain levels and distributions within the material. Introducing strain can enhance carrier mobility and improve device performance, but excessive or non-uniform strain can lead to defects, dislocations, and reliability issues. Developing techniques to accurately model, measure, and manipulate strain at the nanoscale remains a significant obstacle, particularly as device dimensions continue to shrink.
We’ve curated applications and patents from the semiconductor industry over the past three years. Following an auto-landscape analysis, we’ve distilled the following insights. Because of the lag in time between patent filing and publication of the related application (on
average 18 months), this report does not give a complete picture but rather a perspective on
publicly available semiconductor-related patent information up until February 2024.
Summary
TSMC, as a leading semiconductor foundry, has been investing heavily in research and development to stay ahead in the highly competitive semiconductor industry. Their focus on advanced manufacturing processes and cutting-edge technologies has likely contributed to their high patent output.
Who are the top companies working on strain engineering materials in semiconductors?
Companies | Patent Count |
Taiwan Semiconductor Manufacturing Co TSMC Ltd | 70 |
Samsung Electronics Co Ltd | 39 |
International Business Machines Corp | 15 |
Who is collaborating in strain engineering materials in semiconductors?
Companies | Count |
Denso Corp & Mirise Technologies Corp & Toyota Motor Corp | 2 |
Beijing Intellectual Property Operation Management Co Ltd & Peking University | 1 |
BOE Technology Group Co Ltd & Ordos Yuansheng Optoelectronics Co Ltd | 1 |
Ajo University Insdustry Academic Cooperation Foundation & Ajou University Industry Academic Cooperation Foundation | 1 |
Korea University Research and Business Foundation & Samsung Electronics Co Ltd | 1 |
Who are the top inventors who are working on strain engineering materials in semiconductors?
Inventors | Patent count |
Ruilong Xie | 9 |
Yee-Chia Yeo | 9 |
Deyuan Xiao | 8 |
What are the filing trends of strain engineering materials in semiconductors?
Year | Patent count |
2021 | 44 |
2022 | 142 |
2023 | 69 |
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