Slate Blog

In gate stack engineering for semiconductor devices, one of the key challenges is the scaling of the gate dielectric material. As device dimensions shrink, the gate dielectric thickness needs to be reduced to maintain adequate gate control over the channel. However, this leads to increased leakage currents and reliability issues due to the quantum mechanical…

In the area of strain engineering for semiconductors, one of the major challenges is achieving precise control over the strain levels and distributions within the material. Introducing strain can enhance carrier mobility and improve device performance, but excessive or non-uniform strain can lead to defects, dislocations, and reliability issues. Developing techniques to accurately model, measure,…

One of the major challenges in the area of novel channel materials for semiconductors is the need to find alternatives to traditional silicon-based materials that can offer improved performance, energy efficiency, and scalability. As device dimensions continue to shrink, silicon is approaching its fundamental limits, leading to issues such as short-channel effects and increased power…

Artificial Intelligence (AI) and wireless communication are becoming a dynamic duo that could reshape how we interact with our finances, with enhanced security, personalized experiences, and unparalleled convenience in banking. Security with Biometrics and AI Remembering passwords will become past soon. Banks are using AI in wireless communication to make your experience secure. Bank of…