One of the major challenges in interconnect materials for semiconductor devices is the increasing resistance-capacitance (RC) delay as transistors continue to shrink in size. The traditional copper interconnects face limitations due to higher resistivity and electromigration issues at smaller dimensions. This necessitates the exploration of alternative low-resistivity materials with better electromigration resistance and compatibility with existing fabrication processes. Additionally, the integration of these new materials with low-k dielectrics poses challenges in terms of adhesion, thermal stability, and reliability.
We’ve curated applications and patents from the semiconductor industry over the past three years. Following an auto-landscape analysis, we’ve distilled the following insights. Because of the lag in time between patent filing and publication of the related application (on
average 18 months), this report does not give a complete picture but rather a perspective on
publicly available semiconductor-related patent information up until February 2024.
Summary
TSMC, a semiconductor foundry, has filed more patents than major semiconductor companies like Intel and Samsung. This could be due to TSMC’s focus on process technology innovation to stay ahead in the foundry business. TSMC filing more patents than major semiconductor companies could be due to TSMC’s focus on process technology innovation to stay ahead in the foundry business. As a pure-play semiconductor foundry, TSMC’s competitive advantage lies in its ability to develop and manufacture advanced semiconductor processes for its customers. This requires continuous research and development efforts, leading to a higher number of patent filings compared to integrated device manufacturers (IDMs) like Intel and Samsung, which also focus on product design and other aspects of the semiconductor business.
Who are the top companies working on interconnect materials in semiconductors?
| Companies | Patent Count |
| Taiwan Semiconductor Manufacturing Co TSMC Ltd | 253 |
| Samsung Electronics Co Ltd | 143 |
| Intel Corp | 130 |
Who is collaborating on interconnect materials in semiconductors?
| Companies | Count |
| Infinite Computer Solutions Inc & International Business Machines Corp | 2 |
| Etron Technology Inc & Nd Hi Technologies Lab Inc | 1 |
| SNU R&DB Foundation & Samsung Electronics Co Ltd | 1 |
| Rom Technologies Inc & Taiwan Semiconductor Manufacturing Co TSMC Ltd | 1 |
| Shinko Electric Industries Co Ltd & Shinshu University NUC | 1 |
Who are the top inventors who are working on interconnect materials in semiconductors?
| Inventors | Patent count |
| Ruilong Xie | 31 |
| Chih-Chao Yang | 29 |
| Chanro Park | 26 |
What are the filing trends of interconnect materials in semiconductors?
| Year | Patent count |
| 2021 | 461 |
| 2022 | 583 |
| 2023 | 122 |
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